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SuperQ software makes process control and wafer analysis easy
Our SuperQ Thin Film software platform makes accurate process control and wafer analysis easier than ever. It brings rapid and automatic verification of layer and stack information across the complete wafer. The software calculates thickness, composition, stoichiometry, dopant levels and uniformity for a wide range of layer types and stacks.
SuperQ is Windows®-based and allows for intuitive recipe setup. Predefined measurement programs make it easy for even relatively inexperienced staff to run day-to-day analysis as routine tasks - with absolutely secured access. Once the analysis recipe has been set up, on-line analysis can be carried out at the push of a button.
Results can be viewed on-line as measurement proceeds, in a variety of formats, and with distinctive color coding for at-a-glance go/no-go decisions. In addition, results may be automatically transmitted to network drives or printers to generate reports, publications or presentations. Additionally, results can be transferred to a fab host via SECS/GEM .
The software includes our established Fundamental-Parameter Analysis Software for analyzing complex multilayer stacks (FP Multi). Monitoring process limits and –stability can be performed on- or offline using the Statistical Process Control module (SPC).
Key advantages
- Powerful, user-friendly process control software
- Measures film thickness, composition and uniformity across the entire wafer
- Intuitive recipe setup
- Push-button analysis with automatic reporting
- Secure operation through nine user passwords and privilege levels
- SECS/GEM compliant
Current version:
3.2e (PW2830, Semyos)
3.1k (PW2800)
